
Uniting Excellence, Pioneering the Future — Zhuoxing Semiconductor 2025 Year-End Review
Uniting Excellence, Pioneering the Future — Zhuoxing Semiconductor 2025 Year-End Review
2026-02-10(320) views
Zhuoxing Semiconductor demonstrated exceptional strength in 2025 by mastering critical processes and launching multiple leading packaging solutions, earning widespread recognition at international industry summits and receiving prestigious honors such as the "2024 Technology Innovation Demonstration Unit." The company's core products, including the AS3601 pixel die bonder and the EIS2025 Digital Chip Cup Case Award, highlight its leadership in semiconductor packaging innovation. Additionally, Zhuoxing Semiconductor secured 18 new utility model patents and 4 invention patents, further strengthening its technological barriers.
Looking back on 2025, Zhuoxing Semiconductor has moved forward with steady determination. We extend our sincere gratitude to all partners for your continued support, which has helped us witness and achieve our growth and breakthroughs together.
Over the past year, Zoxing Semiconductor has maintained a strong presence at international industry summits. Our R&D team overcame critical process challenges and launched multiple leading packaging solutions, earning customer trust through solid technology and dedicated service. In the new year, we will further deepen technological innovation and expand global collaborations to provide customers with more efficient and reliable chip mounting and packaging services, working hand-in-hand with partners to lead the industry.
As 2025 comes to a close, let's look back at Zhuoxing's memorable moments of excellence.

This year, Zoxing Semiconductor has achieved breakthrough R&D accomplishments and demonstrated leading technological strength, earning"2024 Technology Innovation Demonstration Unit", "Innovative Small and Medium-sized Enterprise" and other prestigious awards.
Additionally,Zhuoxing Semiconductor's AS3601 pixel die bonder won the "Excellence Award of the 12th China LED Innovation Awards" and the "EIS2025 'Digital Chip Cup' Annual Supply Chain Optimization & Innovation Case Award in China's Electronic Communication & Semiconductor Industry."

In 2025, ZH Semiconductor was newly addedUtility Model18Item: New invention patent4Item.

Looking to the future, Zhuoxing Semiconductor will drive innovation and pursue excellence, deepening its mastery of core technologies to propel the growth and continuous breakthroughs of China's domestic semiconductor industry.
In 2025, the Zhuoxing team engaged in deep discussions with customers and partners worldwide at global industry exhibitions, jointly analyzing semiconductor technology trends and ecosystem evolution to explore future development paths for the industry.
3 28,Zhuoxing showcased its products in semiconductor packaging, optical module packaging, and power device packaging at SEMICON CHINA 2025, generating a strong response on-site.

9 10,Zhuoxing Showcases Full Range of Packaging Solutions at SEMICON TAIWAN 2025Covering multiple technical areas including semiconductor packaging, optical module packaging, Mini LED packaging, chip-on-board assembly, and random part placement, it demonstrates exceptional technical capabilities and has garnered significant industry attention.

This year, Zhuoxing Semiconductor continued to deepen its industry expertise by actively participating in numerous professional exhibitions and forums, sharing cutting-edge process solutions and technical breakthroughs.

3rd China International Mini/Micro-LED Industry Ecosystem Conference

2025 2nd China International MLED Display Industry Summit
Looking ahead to 2026, Zhuoxing Semiconductor remains true to its original mission: to become a globally leading semiconductor packaging process service provider, empowering the full value of every chip through technology.
Sincere thanks to all our customers, partners, and the Zhenxing Semiconductor team for your trust and partnership. Wishing you a Happy New Year and a brilliant future!
2026, let's continue to join hands, overcome any distance, and embark on a bright new journey together.

