2025-02-19(3549) views

Recently, the Guangdong Provincial Department of Science and Technology announced the list of 2024 Guangdong Engineering Technology Research Centers. ASMADE Zhuoxing successfully passed the review and was certified as the "2024 Guangdong Flip-Chip COB Packaging Equipment Engineering Technology Research Center" for its outstanding innovation capabilities and industrialization achievements in the flip-chip COB technology field. Guang...

Recently, the Guangdong Provincial Department of Science and Technology announced the list of 2024 Guangdong Engineering Technology Research Centers. ASMADE Zhuoxing was recognized for its...Inverted COB Technology Fieldrecognized for outstanding innovation capabilities and industrialization achievements, successfully passed review and received the 2024 awardGuangdong Engineering Technology Research Center for Inverted COB Packaging Equipmentdetermination!

The evaluation of Guangdong Provincial Engineering Technology Research Centers aims to deeply implement the innovation-driven development strategy, fully leverage the role of these centers in industrial technology R&D and scientific achievement transformation, and effectively promote the mutual reinforcement of provincial industry and science & technology.

Inverted COB Process

Inverted COB, also known as Direct Chip Attach (DCA), is a core advanced technology in semiconductor packaging. It involves mounting the bare die upside down directly onto a printed circuit board without wire bonding, enabling electrical and mechanical connections between the chip and the board. This process offers high reliability, high integration, superior heat dissipation, and cost efficiency.

As a research and development company, ASMADE Zhuoxing is committed to technological innovation and holds core technologies for two major systems:Motion Control Technology and Packaging Process Technology, focusing on the research and development of inverted COB process technology.

About Us

Shenzhen Zhuoxing Semiconductor Technology Co., Ltd. was founded by a world-leading motion control expert team and brings together top-tier packaging technology experts. With over 20 years of technical accumulation and market experience, we are a national high-tech enterprise dedicated to the R&D, manufacturing, and sales of high-precision semiconductor equipment.

The company's core products include advanced packaging equipment, power device packaging equipment, Mini LED chip transfer systems, intelligent control systems, and semiconductor packaging process management software.

The company is committed to providing customers with comprehensive, one-stop semiconductor packaging process solutions. Our products feature fully independent intellectual property rights, and multiple pieces of equipment represent industry firsts.