2026-3-25-On 27, ASMADE will focus on optical module packaging, advanced semiconductor packaging, power devices, and Mini/Micro LED. The company will make a grand debut at SEMICON China and Electronica Shanghai with its brand-new semiconductor die attach solution.

 Date: 3/25-27

Address: Shanghai New International Expo Center

Booth Number

2026 SEMICON China→ 5 Hall 5272、electronica China→ Hall T4 212We look forward to meeting you at the exhibition to discuss technology and collaboration.

Exhibited Products

AS8136 High-Precision Multifunctional Pick-and-Place Machine
High-Precision Semiconductor Die Bonder
Semiconductor Packaging | Third-Generation Turret Mounting | Accuracy ±3 μm
Application scenarios: optical modules, LiDAR, sensors, SIP, Chiplet

AS8123 High-Precision Silver Adhesive Dispenser

Epoxy Die Bonder

Semiconductor Packaging | Four-Point Dispensing System | Compatible with Multiple Wafer Sizes

Application Scenarios: Sensors, SIP, Chiplet, IC, Silver Paste Power Devices, MOS

AS3601 Pixel Sticker Machine

Pixel Die Bonder

Ultra HD Display | RGB Hybrid Solution | Parallel Wiring

Application scenario: Mini LED COB

2026 Booth Infographic

Welcome experts and partners to the event. Connect on cutting-edge technologies, explore collaboration opportunities, and look forward to meeting you at the exhibition to build relationships, uncover new business prospects, and shape a brighter future for our industry!

About Us

Founded by a world-class team of motion control experts and enriched with top-tier packaging technology specialists, this national high-tech enterprise and "Little Giant" specialist company leverages over 20 years of technical heritage and market experience to focus on the R&D, manufacturing, and sales of high-precision semiconductor equipment.

The company's core products include semiconductor packaging equipment, power device packaging equipment, Mini LED chip transfer equipment, intelligent control systems, and semiconductor packaging process management systems.

The company is committed to providing customers with comprehensive, one-stop semiconductor packaging process solutions. Our products feature fully independent intellectual property rights, and multiple pieces of equipment represent industry firsts.