From 2026 to 3, the three-day SEMICON China and Electronica Shanghai concluded successfully at the Shanghai New International Expo Center. As a premier global gathering for the semiconductor industry, this year's exhibition brought together numerous domestic and international exhibitors and professional visitors to witness industry innovation and growth momentum.

During the exhibition, Zhuoxing Semiconductor's booth was bustling with activity as industry peers engaged in in-depth discussions on sector trends, shared technical breakthroughs, and explored collaboration opportunities.

01Featured Booth

At this exhibition, Zhuoxing Semiconductor will primarily showcaseOptical module packaging, advanced semiconductor packaging, power devices, Mini/Micro LEDcore solutions for fields such as.Among them,Optical modules for AI computing chipsLeading products in the packaging domain —AS8136 High-Precision Multifunctional Pick-and-Place MachineFeaturing the third-generation turret mounting architecture, 60% efficiency gains from non-reciprocating operation, and ±3μm precision placement, this solution supports diverse packaging scenarios and integrates AI-driven closed-loop pressure control. It has become a focal point at the exhibition, drawing significant attention and in-depth inquiries from numerous customers and partners.

Additionally, the AS3601 pixel chip bonder features a one-shot three-peak bonding process, mixed-bonding solutions, and parallel line design to enableUltra-HD pixel placement, high-precision coloration, and high-utilization productionWith its stable multi-scenario adaptability, it has become a top inquiry from industry partners.

02Exhibition Concludes

2026 SEMICON China and Electronica Shanghai have established an efficient platform for global semiconductor industry collaboration. We thank all our partners who visited our booth at Zhenxing Semiconductor for your valuable insights and sharing. Moving forward, Zhenxing Semiconductor will continue to focus on technological innovation, collaborate with more industry leaders, and drive high-quality development of the semiconductor sector. We look forward to meeting you again!

Founded by a world-class team of motion control experts and enriched with top-tier packaging technology specialists, 20 years of technical accumulation and market experience drive our mission. We are a national high-tech enterprise and a specialized "Little Giant" company dedicated to the R&D, manufacturing, and sales of high-precision semiconductor equipment. Our core product portfolio includes semiconductor packaging equipment, power device packaging machines, Mini LED die transfer systems, intelligent control devices, and semiconductor packaging process management systems. Committed to delivering comprehensive, one-stop semiconductor packaging solutions, we hold full independent intellectual property rights for our products, with several industry-first innovations.